Searching for Wafer Support System 3m information? Find all needed info by using official links provided below.
http://multimedia.3m.com/mws/media/634385O/3mtm-wafer-support-system-brochure.pdf
The 3M ™ Wafer Support System combines proprietary 3M temporary bonding technologies with world class equipment designed specifically to process wafers using 3M’s wafer support system materials – creating a complete, cost-effective solution for high-volume manufacturing of ultra-thin wafers for 3D TSV and related applications.
https://news.3m.com/press-release/company/3m-introduces-new-system-ultrathin-wafer-backgrinding
SAN FRANCISCO--(BUSINESS WIRE)--3M introduces the 3M Wafer Support System for ultrathin semiconductor wafer backgrinding. The new system is an alternative to the conventional tape process for backgrinding and is capable of producing wafers as thin as 20 microns. This new approach allows semiconductor manufacturers to use their existing grinding equipment to produce thinner wafers, at …
https://www.3m.com/3M/en_US/semiconductor-us/
That includes everything from materials used in etching and deposition, CMP and surface finishing materials for wafer processing, fluids for thermal management, tape and reel for chip transport and materials for wafer doping and ion implantation. And when you partner with 3M, you have global support.
https://pack-n-tape.com/3M-TM-Wafer-Support-Systems/
Enables conventional backgrinding equipment to be used to produce ultra-thin wafers with less cracking, edge chipping and increased die yields. Faster grinding speeds and higher pressures can be used resulting in shorter process times. The system includes all the equipment and consumables necessary for mounting, demounting and removing adhesive from the wafer.
https://smtnet.com/company/index.cfm?fuseaction=view_company&company_id=55969&component=catalog&catalog_id=21634
3M Wafer Support System Description: The 3M Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations. The 3M UV curable adhesive is spun on the wafer surface and is used as a bonding agent between the glass support substrate and the wafer.
https://news.3m.com/press-release/company/3m-and-tazmo-announce-agreement-temporary-wafer-bonding-technology-enable-3-d-
The 3M Wafer Support System includes equipment and materials that allow for temporary wafer bonding to support wafer thinning and subsequent processing of ultra thin wafers for 3D packaging. 3M’s innovative use of a UV curable adhesive for wafer bonding to glass carriers provides robust wafer support throughout wafer grinding and throughout ...
https://www.tazmoinc.com/files/products_wss.html
Wafer Support System (WSS) - Bonder/Debonder: These TWS 2000 and 3000 Series systems were designed for temporarily bonding of ultra thin wafer for advanced 3D packaging requirements. Unique UV hardening resion is used for the bonding of wafer and supporting material realizing excellent TTV, high accuracy alignment, normal temperature bonding ...
https://acronyms.thefreedictionary.com/Wafer+Support+System
Looking for abbreviations of WSS? It is Wafer Support System. Wafer Support System listed as WSS ... In the laboratory's clean room the company has recently installed wafer support system to offer temporary wafer bonding ... Yushin Precision Equipment becomes a 3M Authorized Equipment Supplier for equipment that is configured to use 3M Wafer ...
https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=1560
A new support system is described for wafer thinning applications in which a final die thickness of less than 100 microns is desired. Thinning to 20 microns has been demonstrated, and bumped wafers can be routinely thinned to a final thickness of less than 50 microns. The integrated system consists of mounting and demounting hardware along with associated consumables and is designed to allow ...
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